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Magnetolithography (ML) is a photoresist-less and photomaskless lithography method for patterning wafer surfaces. ML is based on applying a magnetic field on the substrate using paramagnetic metal masks named "magnetic masks" placed on either topside or backside of the wafer. Magnetic masks are analogous to a photomask in photolithography, in that they define the spatial distribution and shape of the applied magnetic field. The fabrication of the magnetic masks involves the use of conventional photolithography and photoresist however. The second component of the process is ferromagnetic nanoparticles that are assembled over the substrate according to the field induced by the mask which blocks its areas from reach of etchants or depositing materials.
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